ROG-STRIX-RTX3080-O10G-GAMING
ROG Strix GeForce RTX 3080 buffed-up design with chart-topping thermal performance.
- NVIDIA Ampere Streaming Multiprocessors: The building blocks for the world’s fastest, most efficient GPU, the all-new Ampere SM brings 2X the FP32 throughput and improved power efficiency
- 2nd Generation RT Cores: Experience 2X the throughput of 1st gen RT Cores, plus concurrent RT and shading for a whole new level of ray tracing performance
- G6X Memory: This is the world’s fastest graphics memory on the GeForce RTX 3090 and RTX 3080.
- Axial-tech Fan Design has been tuned up with more fan blades and a reversed rotational direction for the center fan
- 2.9-slot design expands cooling surface area compared to last gen for more thermal headroom than ever before..
- Super Alloy Power II includes premium alloy chokes, solid polymer capacitors, and an array of high-current power stages.
- GPU Tweak II provides intuitive performance tweaking, thermal controls, and system monitoring.
|
|
|
|
|---|---|---|
Axial-tech UpgradesROG Strix Gaming cards leverage our tried-and-true Axial-tech fan design, with three fans working in tandem to satisfy the thermal demands of NVIDIA’s new high-octane design. The fans rely on dual ball fan bearings to ensure consistent performance and increased longevity compared to sleeve bearings and other bearing types |
New DirectionsThe fans have been smartly tuned with a reversed rotation for the center fan, which reduces turbulence, and with a fan-stop mode that kicks in when the GPU temp falls below 55 degrees. |
MaxContactTo get heat up off the die and into the heat sink array to benefit from the new fan design requires special attention. We use a manufacturing process that polishes the surface of the heat spreader to improve smoothness at the microscopic level. The extra flatness allows for better contact with the die for improved thermal transfer. 2.9-slot Design The heat spreader draws heat up into heat pipes that carry it through a fin stack that fills a large 2.9-slot footprint. Increasing the heat sink size compared to the last generation provides more thermal headroom to account for the new high-performance chipset. |
